Chemlok 6270 adhesive is a low mold fouling rubber-to-substrate bonding adhesive that also offers improved
prebake and environmental resistance when used with an appropriate primer.
This
prebake should be done immediately (less than 1 hr.) prior to reflow.
I also
prebake the crust to make sure it stays crispy on the bottom even after loading on the toppings.
Prebake should be performed at 250[degrees]F (120[degrees]C) for 1 to 6 hr., depending on circuit thickness or material type.
After the
prebake at 150[degrees]C for 5 min, another glass slide was placed on top of the polymer thin film and moved into a model C Carver hot-press (Indiana).
Table 1: Performance and application parameters of PPG Raycron UV Monocoat on Computer Parts Raycron Item Target UV Monocoat Performance Adhesion (PC) good good RCA >1000 >1000 Hardness [greater than [greater than or equal to]H or equal to]H Stain good good resistance QUV good good Steel wool 4 cycles - #0 pass pass Application DFT(um) 10~15 10~15
prebake 60[degrees] 60[degrees] C*5min C*5min Cure 600~1200 600~1200 (MJ/[cm.sup.2]) Gloss level 5~90 5~90 Table 2: Performance and application parameters of PPG RAYCRON[R] UV Monocoat on Cell Phone Parts Raycron Item Target UV Monocoat Performance Adhesion (PC) good good RCA (cycles) >1000 > 1000 Hot Water (1 Hr.
Entirely CTP for about a year and a half, the operation runs three identical lines, with K&F loaders (bought through Kodak) and K&F benders, conveyors, and
prebake processors, according to Peno.
Table 4 -- Hardness with Addition of Water-Dispersible Polyisocyanates Initial Pendulum UV-A Radiation Pendulum Hardness System
Prebake Time/Distance Hardness After 7 Days A--no PIC 7 min at 100[degrees]F No UV 23 sec 34 sec A--no PIC 7 min at 6 min 100[degrees]F 10 in.
Although the Soderberg system has cost advantages in the area of anode production, it is well behind
prebake technology with reference to technical performance and emission control.
More surprisingly, even though her studies indicate that bake-out drives off significant quantities of volatiles, the offgassing rates at the end of the bake were hardly lower than
prebake emissions, though the gases' chemical makeup may have changed.
Chemlok 6270 is an adhesive said to offer improved bonding performance and mold fouling, as well as premium environmental and
prebake resistance.